Kontron Electronics AG, based in Rotkreuz, develops and manufactures electronic products for mechanical engineering, medical technology, and environmental technology, among other sectors. Standard products include touch panels, industrial controllers, I/O modules, Raspberry Pi, and more.
As part of this Reffnet case, we were able to conduct comprehensive consulting on packaging optimization for the company.
The aim was to examine the recyclability of the various types of packaging used and to identify opportunities for material and emission reduction.
One aspect of the analysis was the replacement of previously used materials with alternative materials that have a lower environmental impact. In addition, we examined whether certain products could also be shipped in smaller or different packaging (with less packaging material).
Source material
Specifically, we analyzed the following three packaging types in more detail:
In addition, options for replacing the filling material – currently polystyrene chips – were investigated.
Possible measures for packaging optimization
We were able to identify five measures and considered them in more detail with regard to their feasibility and environmental impact:
- For the fixation packaging, there is the option of using a more ecological film to reduce the environmental impact. Compared to other polymers, polyurethane has a rather high CO2-eq. value per kg, for example compared to polyethylene.
- One option would be to switch from the foam box to a medium-sized fixation packaging (one size larger than the small fixation packaging) for medium-sized parts. A larger model of the fixation packaging uses more cardboard than the foam box or the small fixation packaging. However, since the film weighs much less than the foam, the environmental impact is lower for a larger fixation packaging than for the foam box.
- As already mentioned, polyurethane foam has a high environmental impact. Replacing the polyurethane foam in the foam box could therefore lead to a reduced environmental impact. A possible replacement would be a molded fiber insert (similar to cardboard). However, this is not suitable for all applications.
- LDPE supports are used in the folding box to fix and protect the products. There is currently no recycling system for these supports. As an alternative to the plastic supports, cardboard supports could be used.
- As an alternative to the chips, a cardboard net could be used. This offers two advantages: firstly, cardboard that is no longer needed can be reused as filling material, and secondly, the filling material can then be recycled (see picture below).
The life cycle assessment of the measures shows that replacing the low-density polyethylene foam supports with cardboard supports has only a very slight environmental benefit, which is still within the uncertainty range of the life cycle assessment. For this reason, we have recommended that measures 1, 2, 3, and 5 be pursued further.
